JR0073635 - Assembly & Finish Process and Equipment Engineer

Assembly & Finish Process and Equipment Engineer
Job Description

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors. Reviews product requirements with design staff to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts and approaches in the processing or development of new or improved processes in photomasking, diffusion, deposition, wafer fabrication and device physics. Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results.

Qualifications

1. Bachelor of Engineering, major in Electrical/Electronic Engineering, Mechanical/Mechatronic Engineering, or related disciplines

2. Strong verbal, written, and communication skills in English.

3. Can work on shift (12 hours/day, 4 days/week) if required to support Manufacturing/ New Product Introduction. Strong technical knowledge in equipment and process, strong problem solving skill to resolve complex issues.

4. Able to work effectively either independence or in a team, be proactive to challenge status quo, be honest/direct/constructive confrontation. Professional to ensure meet commitment 100% of the time.

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth